GlobalFoundries Finalizes $375 Million CHIPS Act Award for Onshore Quantum Semiconductor Fabrication

Semiconductor manufacturer GlobalFoundries (NASDAQ: GFS) has finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office to receive up to $375 million in federal R&D funding under the CHIPS and Science Act. Distributed over a five-year milestone-based schedule, the award accelerates the expansion of GF’s dedicated Quantum Technology Solutions (QTS) business unit at its Malta, New York manufacturing complex to scale domestic quantum hardware production from research prototypes to volume fabrication. The agreement advances a secure, U.S.-based quantum semiconductor ecosystem. GF’s QTS platform leverages its established 22FDX (22nm Fully Depleted Silicon-On-Insulator / FD-SOI) foundry node—a process widely utilized for cryogenic CMOS control and readout integrated circuits (ICs) operating at millikelvin temperatures. The 22FDX architecture, which incorporates embedded magnetoresistive non-volatile memory (eMRAM) for fast, low-power state retention and working memory sub-systems, provides a foundational silicon substrate for cryogenic spin-qubit controllers, 3D heterogeneous packaging, and multi-modality quantum-classical interconnects across silicon-spin, trapped-ion, photonic, topological, and superconducting QPUs. | [ GlobalFoundries QTS Award & Manufacturing Infrastructure Scope ] | || |---|---|---| | Capital Allocation & Vehicle | Fab Infrastructure & Node Stack | Ecosystem Capabilities & Scope | | • $375 Million Direct Award • CHIPS R&D Office Agreement • 5-Year Milestone Schedule | • Malta, NY 300mm Fab Complex • 22FDX (22nm FD-SOI) Cryo-CMOS • Embedded MRAM (eMRAM) & 3D Packaging | • Cryo-Control & Readout Scaling • Prototyping-to-Volume Fab Lines • Alignment with $300M Silicon Photonics LOI | Led by Nicholas Sergeant, Vice President and General Manager of QTS, GF provides commercial foundry access for hardware developers transitioning from lab prototypes to high-yield wafer production. The finalized $375 million agreement complements GF’s broader $300 million CHIPS LOI targeting silicon photonics R&D, reinforcing onshore microelectronics supply chains for high-performance computing (HPC), defense, and AI supercomputing infrastructure. Review the official press release via GlobalFoundries here, inspect 22FDX platform specifications at GlobalFoundries 22FDX eMRAM Briefing here, and examine our prior coverage of GlobalFoundries’ Quantum Technology Solutions Business Unit Launch here and the U.S. Department of Commerce’s $2 Billion CHIPS Quantum Allocations here. September 18, 2026 Leave A Comment