HANMI Semiconductor Ships First ‘FC Bonder 75’ for AI System Semiconductors

HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High Bandwidth Memory (HBM) into system semiconductor packaging. As AI semiconductors become increasingly sophisticated, 2.5D packaging technologies that integrate multiple chips — including CPUs, GPUs, and HBM — into a single package have gained prominence, driving an expansion in interposer and substrate size. This, in turn, is increasing the demand for higher-specification packaging equipment among foundries and outsourced semiconductor assembly and test (OSAT) companies. A prominent example of 2.5D packaging technology is TSMC’s Chip on Wafer on Substrate (CoWoS). TSMC plans to further advance its packaging methods from CoWoS to Chip on Panel on Substrate (CoPoS) and 3D System on Integrated Chips (3D-SoIC), as adoption of TSMC’s packaging technology has been increasing among OSAT providers. More recently, Intel’s Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology has increasingly been applied to the application-specific integrated circuit (ASIC) chips of U.S. technology leaders, including Google’s TPUs. The FC Bonder 75 is a flip-chip (FC) bonding system, which places semiconductor dies face down so conductive bumps on the chip connect directly to an interposer. This enables the high-density interconnections and shorter electrical paths that are widely used in advanced 2.5D packages. HANMI Semiconductor’s FC Bonder 75 supports interposer packages measuring 75 mm × 75 mm, compared with the conventional general-purpose packaging size of 20 mm × 20 mm. The larger format accommodates the ultra-large dies and multi-chip integration required for next-generation AI semiconductors. HANMI Semiconductor has also expanded its 2.5D packaging equipment portfolio. This year, the company has launched the “FC Bonder 3.5,” “2.5D TC Bonder 40 C2S,” and “2.5D TC Bonder 40 C2W,” and is preparing to launch the “2.5D TC Bonder 120.” The broader equipment lineup is expected to create synergy with the establishment of its U.S. subsidiary, HANMI USA, planned for October of this year. This move is intended to serve demand from major technology companies, foundries, OSAT providers, and memory manufacturers in the U.S., where operations are expected to ramp up in earnest by 2028. “Starting with the FC Bonder 75, we are expanding our technological competitiveness in the AI semiconductor market by supplying our customers with TC Bonders for HBM and AI packaging, as well as a wide range of other packaging equipment,” said a HANMI Semiconductor official. “Through these products, we will continue to deliver sustainable revenue growth.”