Chip Industry Technical Paper Roundup: July 21
Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating and rad-hard; monolithic CMOS-photonic integration; quantum photonic chips; AI-driven thermal modeling for 3D photonic circuits.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| StreamDQ: Near-Memory Weight DeQuantization in Custom HBM for Scalable AI Inference Acceleration | SK hynix |
| Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM | Georgia Institute of Technology |
| Evaluating Hardware Abstraction Layer Concepts for Software Defined Vehicles: Insights into Applicability and Effectiveness | University of Stuttgart |
| Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques | San Jose State University, Sandia National Laboratories |
| Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics | MITRE, University of Colorado Boulder, Sandia National Laboratories, University of Arizona, MIT |
| Design and Benchmarking of a Quantum Photonic Chip | Rotonium, National University of Singapore, Inveriant, Politecnico di Milano, CNIT |
| AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits | University of Florida, ficonTEC Service, Colorado State University |
Find more semiconductor research papers here.
Leave a Reply
How it works
Once you click Generate, Ollama reads this article and crafts 5 comprehension questions. Your answers are graded against the article content — general knowledge won't be enough. Score 70+ to count toward your certificate.
Questions are cached — you'll always get the same 5 for this article.